CAE Development Engineer - (Heat Transfer/CFD)

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The CAE Development Engineer is responsible for supporting product design and development through computer-based design analysis activities. This role primarily consists of CAE simulation focusing on heat transfer / CFD analysis, analytical modeling, correlation testing, along with data interpretation and report writing. This role also focuses on implementing new initiatives and capability developments for the Products that are focused on electric vehicle drivelines and transmissions. In addition this role includes coaching and mentoring thermal team in the project execution.

The key responsibilities:

• Interact with Mechanical Design and product engineers to understand the design and performance requirements.
• Conduct CAE analysis by using right modeling techniques and making right assumptions. Use commercial tools such as Icepak, Fluent or ANSYS as needed.
• Technical expertise in analytical modeling of CFD/Heat Transfer fundamentals
• Understand thermal or flow performance, interpret results intelligently and develop design improvements.
• Participate in peer reviews, failure analysis and drive product improvements as necessary
• Will mentor and coach thermal team and review the technical reports
• Participate and support in global COE activites
• Writing reports for summarizing the analysis results and reviewing all project-related analysis results for ensuring the accuracy of project reports.

Required Qualifications and Skills:

• M.Tech in Mech/Aero/Applied Mechanics from a reputed institution such as IIT/IISc/REC
• Experience Level: 8 - 14 years of experience in Heat Transfer ,CFD and

      thermal management of electronics

• Strong fundamentals in heat transfer and fluid dynamics
• Knowledge of Commercial tools such as Icepak, Flotherm, Fluent, Ansys Workbench, ICEM CFD, Hypermesh
• Strong understanding of physics related to thermal performance of components in harsh and dynamic environment such as in automotive industry
• Experience in Electronics Cooling , die and PCB level modeling is a required
• Experience in Thermal-Electric simulationg using ANSYS Maxwell is a plus
• Good communication skills both oral/writing

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